For surface mounted applications in order to optimize board space * Low profile package * Built-in strain relief * Glass passivated junction * Low inductance * Excellent clamping capability * Repetition Rate(duty cycle):0.05% * Fast response time: typically less than 1.0ps from 0 Volts to BV min * Typical IR less than 1μA above 10V * High temperature soldering: 250°C/10 seconds at terminals * Plastic package has Underwriters Laboratory Flammability 94V-O
