| Part number | WED3C755E8M-XBX |
|---|---|
| Download | WED3C755E8M-XBX Datasheet (PDF) |
| File Size | 377.53 KB |
| Manufacturer | White Electronic Designs Corporation |
| Description | RISC MICROPROCESSOR MULTI-CHIP PACKAGE |
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| Part Number | Description |
|---|---|
| WED3DG64126V-D2 | 1GB - 128M X 64 SDRAM Unbuffered |
| WED3DG64128V-D1 | 1GB - 128M X 64 SDRAM Unbuffered |
| WED3DG6419V-D2 | 128MB - 16Mx64 SDRAM UNBUFFERED |
| WED3DG6466V-D2 | SDRAM UNBUFFERED |
| WED3DG649V-D2 | 64MB- 8M x 64 SDRAM UNBUFFERED |
White Electronic Designs WED3C755E8M-XBX RISC MICROPROCESSOR MULTI-CHIP PACKAGE OVERVIEW The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management.
