W3H32M72E-XSBX Overview
Key Features
- 208 Plastic Ball Grid Array (PBGA), 18 x 20mm
- 1* tCK Commercial, Industrial and Military Temperature Ranges Organized as 32M x 72 Weight: W3H32M72E-XSBX
- (602) 437-1520
| Part | W3H32M72E-XSBX |
|---|---|
| Description | 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| Manufacturer | White Electronic Designs |
| Size | 965.20 KB |
Related Datasheets
| Part Number | Manufacturer | Description |
|---|---|---|
| SOT23-6 | Zetex Semiconductors | Package information |
| SOT23-6 | Holtek Semiconductor | 6-pin Package Information |
| H-03-1 | Analog Devices | 3-Pin Metal Header Package |