W3H32M72E-XSBX
W3H32M72E-XSBX is 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package manufactured by White Electronic Designs.
White Electronic Designs
PRELIMINARY-
32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
Features
Data rate = 667- , 533, 400 Package:
- 208 Plastic Ball Grid Array (PBGA), 18 x 20mm
- 1.0mm pitch Differential data strobe (DQS, DQS#) per byte .. Internal, pipelined, double data rate architecture 4-bit prefetch architecture DLL for alignment of DQ and DQS transitions with clock signal Four internal banks for concurrent operation (Per DDR2 SDRAM Die) Programmable Burst lengths: 4 or 8 Auto Refresh and Self Refresh Modes On Die Termination (ODT) Adjustable data
- output drive strength Single 1.8V ±0.1V supply Programmable CAS latency: 3, 4, 5, or 6 Posted CAS...
