W72M64VK-XBX - 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package

Description

1 A B C VCC 2 GND 3 GND 4 GND 5 VCC 6 VCC 7 GND 8 GND 9 10 GND VCC GND DQ41 WE3# VCC DQ57 DNU WE4# VCC VCC VCC DQ33 DQ43 DQ45 DQ47 DQ49 DQ59 DQ61 DQ63 VCC D VCC DQ40 www.DataSheet4U.com E F G H J K L M N P R T VCC DQ32 DQ35 DQ37 DQ39 DQ56 DQ51 DQ53 DQ55 VCC DQ0-

Features

Access Times of 90, 100, 120ns Packaging.
159 PBGA, 13x22mm - 1.27mm pitch 1,000,000 Erase/Program Cycles Sector Architecture.
Bank 1 (4Mb): eight 4K word, eight 32K word www. DataSheet4U. com Unlock Bypass Program command.
Reduces overall programming time when issuing multiple program command sequences Ready/Busy# output (RY/BY#).
Hardware method for detecting program or erase cycle completion Hardware reset pin (RESET#).
Hardware method of resetting.

White Electronic Designs

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Datasheet Details

Part number	W72M64VK-XBX
Manufacturer	White Electronic Designs
File Size	598.63 KB
Description	2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package
Datasheet	W72M64VK-XBX Datasheet
Additional preview pages of the W72M64VK-XBX datasheet.

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White Electronic Designs W72M64VK-XBX 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package FEATURES Access Times of 90, 100, 120ns Packaging • 159 PBGA, 13x22mm - 1.27mm pitch 1,000,000 Erase/Program Cycles Sector Architecture • Bank 1 (4Mb): eight 4K word, eight 32K word www.DataSheet4U.

Published: Jul 28, 2008 |