Datasheet4U Logo Datasheet4U.com

WF1M32B-XXX3 - 1Mx32 3.3V Flash Module

Description

I/O0-31 A0-19 Data Inputs/Outputs Address Inputs Write Enable Chip Selects Output Enable Reset Power Supply Ground Not Connected 23 I/O15 I/O14 I/O13 I/O12 OE# A17 WE# I/O7 I/O6 I/O5 I/O4 33 I/O24 I/O25 I/O26 A7 A12 NC A13 A8 I/O16 I/O17 I/O18 34 VCC CS4# NC I/O27 A4 A5 A6 NC CS3# GND I/O19 44 45

Features

  • Access Times of 100, 120, 150ns.
  • Packaging.
  • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401).
  • 68 lead, Low Profile CQFP (G2T), 4.6mm (0.180") square (Package 509).
  • 1,000,000 Erase/Program Cycles Sector Architecture.
  • One 16KByte, two 8KBytes, one 32KByte, and fifteen 64kBytes in byte mode.
  • Any combination of sectors can be concurrently erased. Also supports full chip erase.
  • Organized as 1Mx32 Commercial, Industr.

📥 Download Datasheet

Datasheet preview – WF1M32B-XXX3

Datasheet Details

Part number WF1M32B-XXX3
Manufacturer White Electronic
File Size 507.82 KB
Description 1Mx32 3.3V Flash Module
Datasheet download datasheet WF1M32B-XXX3 Datasheet
Additional preview pages of the WF1M32B-XXX3 datasheet.

📁 Similar Datasheet

Other Datasheets by White Electronic

Full PDF Text Transcription

Click to expand full text
www.DataSheet4U.com White Electronic Designs 1Mx32 3.3V Flash Module FEATURES Access Times of 100, 120, 150ns ■ Packaging • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401) • 68 lead, Low Profile CQFP (G2T), 4.6mm (0.180") square (Package 509) ■ ■ 1,000,000 Erase/Program Cycles Sector Architecture • One 16KByte, two 8KBytes, one 32KByte, and fifteen 64kBytes in byte mode • Any combination of sectors can be concurrently erased. Also supports full chip erase ■ ■ ■ Organized as 1Mx32 Commercial, Industrial and Military Temperature Ranges 3.3 Volt for Read and Write Operations ■ ■ ■ ■ ■ ■ ■ WF1M32B-XXX3 Boot Code Sector Architecture (Bottom) Low Power CMOS, 1.
Published: |