25Q32JWTIM
FEATURES
4 3. PACKAGE TYPES AND PIN CONFIGURATIONS 5
3.1 Pin Configuration SOIC 150-mil / 208-mil 5 3.2 Pad Configuration WSON 6x5-mm, XSON 4x4-mm, USON4x3-mm 5 3.3 Pin Description
SOIC 150/208-mil, WSON 6x5-mm, XSON 4x4-mm, USON4x3-mm 5 3.4 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) 6 3.5 Ball Description
TFBGA 8x6-mm 6 3.6 Ball Configuration WLCSP 7 3.7 Ball Description
WLCSP12...
