• Part: 25Q40BLVIG
  • Description: 2.5V 4M-BIT SERIAL FLASH MEMORY
  • Manufacturer: Winbond
  • Size: 1.80 MB
Download 25Q40BLVIG Datasheet PDF
Winbond
25Q40BLVIG
25Q40BLVIG is 2.5V 4M-BIT SERIAL FLASH MEMORY manufactured by Winbond.
- Part of the 25Q40BL comparator family.
DESCRIPTION ............................................................................................................... 5 2. Features ....................................................................................................................................... 5 3. PACKAGE TYPES ............................................................................................................................ 6 3.1 Pin Configuration SOIC /VSOP 150-mil, SOIC 208-mil........................................................ 6 3.2 Pad Configuration WSON 6X5-mm, USON 2X3-mm .......................................................... 6 3.3 Pin Configuration PDIP 300-mil ............................................................................................ 6 3.4 Pin Description SOIC, VSOP, WSON, USON, PDIP ........................................................... 6 4. PIN DESCRIPTIONS ........................................................................................................................ 7 4.1 Chip Select (/CS) .................................................................................................................. 7 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3)..................................... 7 4.3 Write Protect (/WP) .............................................................................................................. 7 4.4 HOLD (/HOLD) ..................................................................................................................... 7 4.5 Serial Clock (CLK) ................................................................................................................ 7 5. BLOCK DIAGRAM ............................................................................................................................ 8 6. FUNCTIONAL DESCRIPTION ......................................................................................................... 9 6.1 SPI OPERATIONS...