Winbond Electronics Corporation 25X16
Serial Flash Memory
GENERAL DESCRIPTION
......................................................................................................... 4 2.FEATURES
................................................................................................................................. 4 3. PIN CONFIGURATION SOIC 150-MIL....................................................................................... 5 4. PIN CONFIGURATION SOIC 208-MIL....................................................................................... 5 5. PAD CONFIGURATION WSON 6X5-MM & 8X6-MM ................................................................ 5 6. PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 6 7. PINDESCRIPTION
SOIC 150 / 208-MIL, PDIP 300-MIL, WSON 6X5 / 8X6-MM ..................... 6 8. PIN CONFIGURATION SOIC 300-MIL....................................................................................... 7 9. PINDESCRIPTION
SOIC 300-MIL ............................................................................................