Winbond Electronics Corporation 25X40
W25X40
GENERAL DESCRIPTION
......................................................................................................... 4FEATURES
................................................................................................................................. 4 PIN CONFIGURATION SOIC 150-MIL....................................................................................... 5 PIN CONFIGURATION SOIC 208-MIL....................................................................................... 5 PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 5 PIN CONFIGURATION WSON 6X5-MM .................................................................................... 6 PINDESCRIPTION
..................................................................................................................... 6 7.1 7.2 7.3 7.4 7.5 7.6 7.7 8. 9. Package Types ...............................................................................................................