W25M321AV Datasheet PDF | Winbond Electronics Corporation

Winbond Electronics Corporation W25M321AV

The W25M321AV (32M-bit Serial NOR + 1G-bit Serial NAND) Serial MCP (Multi Chip Package) Flash memory is based on the popular W25Q/W25N SpiFlash® series by stacking W25Q32JV and W25N01GV into a standard 8-pin package. It offers flexible memory density and reliability combination for the low pincount package, as well as Concurrent Operations in Serial Flash memory for the first time. The W25M SpiStack® series is ideal for small form factor system designs, and applications that demand high Program/Erase data throughput.

Part No.	W25M321AV
Datasheet	W25M321AV Download
Manufacturer	Winbond Electronics Corporation
Description	SERIAL MCP FLASH MEMORY
Buy	Stock & Price

FEATURES

....................................................................................................................................... 3 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 4 3.1 Pad Configuration WSON 8x6-mm ...................................................................................... 4 3.2 Pad

DESCRIPTION

WSON 8x6-mm.......................................................................................... 4 4. DEVICE CONFIGURATION & PIN DESCRIPTIONS....................................................................... 5 4.1 Serial MCP (SpiStack®) Device Configuration ..................................................................... 5 4.2 Chip Select (/CS).................................................................................................................. 5 4.3 Serial Input & Output (DI, DO and IO0, IO1, IO2, IO3) ........................................................ 5 4.4 Serial Clock (CLK) ................................................................................................................