W25Q01JV Datasheet | Winbond

3V 1G-BIT (DUAL DIE) SERIAL FLASH MEMORY WITH DUAL/QUAD SPI Publication Release Date: November 13, 2019 -Revision B1 Table of Contents 1. GENERAL DESCRIPTIONS........................................................................................................ 5 2. Features ................................................................................................................................. 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ...................................................................... 7 3.1 Pad Configuration WSON 8x6-mm .................................................................................. 7 3.2 Pad Description WSON 8x6-mm ..................................................................................... 7 3.3 Pin Configuration SOIC 300-mil ....................................................................................... 8 3.4 Pin Description SOIC 300-mil .......................................................................................... 8 3.5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array)............................................... 9 3.6 Ball Description TFBGA 8x6-mm ..................................................................................... 9 4. PIN DESCRIPTIONS................................................................................................................. 10 4.1 Chip Select (/CS) ........................................................................................................... 10 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO12, IO3)..................................... 10 4.3 Write Protect (/WP)........................................................................................................ 10 4.4 HOLD (/HOLD) .............................................................................................................. 10 4.5 Serial Clock (CLK) .................................................................................