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CAS300M12BM2 - Half-Bridge Module

Key Features

  • Industry Standard 62 mm Footprint.
  • Ultra Low Loss, High-Frequency Operation.
  • Zero Reverse Recovery from Diodes.
  • Zero Turn-off Tail Current from MOSFET.
  • Normally-off, Fail-safe Device Operation.
  • Copper Baseplate and Aluminum Nitride Insulator C V+ G1 K1 Mid G2 K2 V-.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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CAS300M12BM2 5 1200 V, 300 A, Silicon Carbide, Half-Bridge Module VDS IDS4 1200 V 3 300 A 2 D Technical Features • Industry Standard 62 mm Footprint • Ultra Low Loss, High-Frequency Operation • Zero Reverse Recovery from Diodes • Zero Turn-off Tail Current from MOSFET • Normally-off, Fail-safe Device Operation • Copper Baseplate and Aluminum Nitride Insulator C V+ G1 K1 Mid G2 K2 V- Applications • Induction Heating • Motor Drives • Renewables • Railway Auxiliary & Traction • EV Fast Charging • UPS and SMPS System Benefits 3 • 62 mm Form Factor Enables System Retrofit • Increased System Efficiency, due to Low Switching & Conduction Losses of SiC B 4 5 1 Key Parameters 6 7 2 Parameter Symbol Min. Typ. Max.