1N4001WS
Key Features
- Low profile space
- Ideal for automated placement
- Glass passivated chip junctions
- Low forward voltage drop
- Low leakage current
- High forward surge capability
- High temperature soldering： 260℃/10 seconds at terminals Mechanical Data
- Case: SOD-323 molded plastic body over glass passivated chip I
- Terminals: Solder plated, solderable per JESD22-B102
