XCCACEM32 - (XCCACEM16 - XCCACEM64) System ACE MPM Solution

This page provides the datasheet information for the XCCACEM32, a member of the XCCACEM16 (XCCACEM16 - XCCACEM64) System ACE MPM Solution family.

Datasheet Summary

Description

The System ACE Multi-Package Module (MPM) solution addresses the need for a space-efficient, pre-engineered, high-density configuration solution in multiple FPGA systems.

Features

tMAP bus and is connected to D1 on all target FPGAs. For Slave-Serial configuration mode, CFG_DATA[2] is the serial data signal for Serial-Slave Chai.

XILINX

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Datasheet Details

Part number	XCCACEM32
Manufacturer	XILINX
File Size	337.13 KB
Description	(XCCACEM16 - XCCACEM64) System ACE MPM Solution
Datasheet	XCCACEM32 Datasheet
Additional preview pages of the XCCACEM32 datasheet.

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Full PDF Text Transcription

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www.DataSheet4U.com 0 R System ACE™ MPM Solution 0 0 DS087 (v1.2) June 7, 2002 Advance Product Specification Summary • System level, high capacity, pre-configured solution for Virtex™ Series FPGAs, Virtex-II Series Platform FPGAs, and Spartan™ FPGAs Industry standard Flash memory die combined with Xilinx controller technology in a single package Effortless density migration: - XCCACEM16-BG388I (16 Megabit (Mb)) - XCCACEM32-BG388I (32 Mb) - XCCACEM64-BG388I (64 Mb) All densities are available in the 388-pin Ball Grid Array package VCC I/O: 1.8V, 2.5V, and 3.

Published: Jan 8, 2007 |