XC2V3000 Overview
Device/Package binations and Maximum I/O Ordering Information Module 3: DC and Switching Characteristics DS031-3 (v3.0) August 1, 2003 38 pages Performance Characteristics Switching Characteristics Pin-to-Pin Output Parameter Guidelines Pin-to-Pin Input Parameter Guidelines DCM Timing Parameters Module 2: The Virtex-II Platform FPGA data sheet is created and published in separate modules.
XC2V3000 Key Features
- Electrical Characteristics Performance Characteristics Switching Characteristics Pin-to-Pin Output Parameter Guidelines
- Detailed Description Digitally Controlled Impedance (DCI) Configurable Logic Blocks (CLBs) Sum of Products 3-State Buffe
- Pin Definitions Pinout Tables
- CS144 Chip-Scale BGA Package
- FG256 Fine-Pitch BGA Package
- FG456 Fine-Pitch BGA Package
- FG676 Fine-Pitch BGA Package
- BG575 Standard BGA Package
- BG728 Standard BGA Package
- FF896 Flip-Chip Fine-Pitch BGA Package