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XC3S700AN Datasheet Spartan-3an Fpga

Manufacturer: Xilinx (now AMD)

Overview: 1 Spartan-3AN FPGA Family Data Sheet DS557 January 9, 2019 Product Specification Module 1: Introduction and Ordering Information DS557(v4.

This datasheet includes multiple variants, all published together in a single manufacturer document.

General Description

DS557 (v4.3) January 9, 2019 The functionality of the Spartan®-3AN FPGA family is described in the following documents: • UG331: Spartan-3 Generation FPGA User Guide • Clocking Resources • Digital Clock Managers (DCMs) • Block RAM • Configurable Logic Blocks (CLBs) - Distributed RAM - SRL16 Shift Registers - Carry and Arithmetic Logic • I/O Resources • Embedded Multiplier Blocks • Programmable Interconnect • ISE® Design Tools and IP Cores • Embedded Processing and Control Solutions • Pin Types and Package Overview • Package Drawings • Powering FPGAs • Power Management • UG332: Spartan-3 Generation Configuration User Guide • Configuration Overview • Configuration Pins and Behavior • Bitstream Sizes • Detailed Descriptions by Mode - Self-contained In-System Flash mode - Master Serial Mode using Platform Flash PROM - Master SPI Mode using Commodity Serial Flash - Master BPI Mode using Commodity Parallel Flash - Slave Parallel (SelectMAP) using a Processor - Slave Serial using a Processor - JTAG Mode • ISE iMPACT Programming Examples • MultiBoot Reconfiguration • Design Authentication using Device DNA • UG333: Spartan-3AN In-System Flash User Guide • UG334: Spartan-3AN Starter Kit User Guide Module 3: DC and Switching Characteristics DS557 (v4.3) January 9, 2019 • DC Electrical Characteristics • Absolute Maximum Ratings • Supply Voltage Specifications • Recommended Operating Conditions • Switching Characteristics • I/O Timing • Configurable Logic Block (CLB) Timing • Multiplier Timing • Block RAM Timing • Digital Clock Manager (DCM) Timing • Suspend Mode Timing • Device DNA Timing

Key Features

  • s.
  • Architectural Overview.
  • Configuration Overview.
  • In-system Flash Memory Overview.
  • General I/O Capabilities.
  • Supported Packages and Package Marking.
  • Ordering Information Module 2: Functional.

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