XQR2V3000 Datasheet | Xilinx

.Data Sheet.co.kr QPro Virtex-II 1.5V Radiation Hardened QML Platform FPGAs 0 0 DS124 (v1.1) January 8, 2004 Product Specification Summary of Radiation Hardened QPro™ Virtex™-II Features - - - - Industry First Radiation Hardened Platform FPGA Solution Guaranteed total ionizing dose to 200K Rad(si) Latch-up immune to LET > 160 Me V-cm2/mg SEU in GEO upsets < 1.5E-6 per device day achievable with remended redundancy implementation Certified to MIL-PRF-38535 (Qualified Manufacturer Listing) Guaranteed over the full military temperature range (- 55° C to +125° C) Ceramic and Plastic Wire-Bond and Flip-Chip Grid Array Packages IP-Immersion Architecture - Densities from 1M to 6M system gates - 300+ MHz internal clock speed (Advance Data) - 622+ Mb/s I/O (Advance Data) Select RAM™ Memory Hierarchy - 2.5 Mb of dual-port RAM in 18 Kbit block Select RAM resources - Up to 1 Mb of distributed Select RAM resources High-Performance Interfaces to External Memory - DRAM interfaces - - - SDR/DDR SDRAM Network FCRAM Reduced Latency DRAM SDR/DDR SRAM QDR SRAM - - - Precise clock de-skew Flexible frequency synthesis High-resolution phase shifting - - - - - - - 16 global clock multiplexer buffers Active Interconnect Technology - Fourth generation segmented routing structure - Predictable, fast routing delay, independent of fanout Select IO™-Ultra Technology - Up to 824 user I/Os - 19 single-ended and six differential standards - Programmable sink current (2 m A to 24 m A) per I/O - Digitally Controlled Impedance (DCI) I/O: on-chip termination resistors for single-ended I/O standards - Differential Signaling - -...