TECC16CA
Features
DO-214AA/SMB
For surface mounted applications in order to optimize board space Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Repetition Rate (duty cycle):0.05% Fast response time: typically less than 1.0ps from 0 Volts to V(BR) for unidirectional types Typical IR less than 1µA above 10V High Temperature solderting: 260°C/10 seconds at terminals Plastic package has Underwriters Laboratory Flammability 94V-O Pb-free plated
0.087 (2.20) 0.071 (1.80)
0.096(2.44) 0.084(2.13) 0.060(1.52) 0.030(0.76)
0.180(4.57) 0.160(4.06)
0.008(0.203)MAX. 0.220(5.59) 0.200(5.08)
0.155(3.94) 0.130(3.30)
0.012(0.305) 0.006(0.152)
Mechanical Data
Uni-Polar
Bi-Polar
Case: JEDEC DO-214AA. Molded plastic over glass passivated junction Terminals: Solderable per MIL-STD-750,Method 2026 Polarity: Color band denoted positive end (cathode) except Bidirectional Standard Packaging:12mm tape (EIA STD RS-481)
Dimensions in inches and...
