XP4024EH
Description
XP4024 series are innovated design and silicon process technology to achieve the lowest possible on-resistance and fast switch- ing performance. It provides the designer with an extreme efficient device for use in a wide range of power applications. The TO-252 package is widely preferred for all mercial-industrial surface mount applications using infrared reflow technique and suited for high current application due to the low connection resistance.
BVDSS RDS(ON) ID
30V 6mΩ 60A
TO-252(H)
Absolute Maximum Ratings
Symbol
Parameter
VDS VGS ID@TC=25℃ ID@TC=100℃ IDM PD@TC=25℃ PD@TA=25℃ TSTG TJ
Drain-Source Voltage Gate-Source Voltage Drain Current, VGS @ 10V, (Chip) Drain Current, VGS @ 10V, (Chip) Pulsed Drain Current1 Total Power Dissipation Total Power Dissipation3
Storage Temperature Range Operating Junction Temperature Range
Rating 30 +20 60 38 160 36.7 2
-55 to 150 -55 to 150
Units V V A A A W W ℃ ℃
Thermal Data
Symbol
Parameter
Rthj-c Rthj-a
Maximum...
