GS1010FL
Overview
- For surface mounted applications
- Low profile package
- Ideal for automated placement
- High temperature soldering : 260℃/10 seconds at terminals
- Glass passivated chip junction
- Lead‐free & halogen‐free parts, RoHS compliant
- Mechanical Data
- Epoxy: UL94V‐0 rated flame retardant
- Case: Molded Plastic
- Terminals: Solder plated solderable per MIL‐STD‐750 Method 2026
