• Part: IC264
  • Description: Ball Grid Array
  • Manufacturer: Yamaichi Electronics
  • Size: 249.68 KB
Download IC264 Datasheet PDF

Datasheet Summary

.DataSheet.co.kr IC264 Series (Open Top) Specifications Ball Grid Array (BGA, 1.50mm Pitch) Part Number (Details) 1,000MW min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute Contact Resistance: 1 W max. at 10mA/20mV max. Operating Temperature Range: - 40°C to +150°C 10,000 insertions min. Mating Cycles: 225 contact pins Pin Count: 25g to 35g per individual Contact Force: contact pin Series No. - 225 01 - 1 - - - - MF No. of Contact Pins Design Number NN: Without Positioning Pin #1, #2 NP: Without Positioning Pin #1, With Positioning Pin #2 PN: With Positioning Pin #1, Without Positioning Pin #2 Blank: With Positioning Pin #1, #2 MF =...