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NP352 - Fine Ball Grid Array

Key Features

  • í Open top type sockets with "Tweezer Style Contacts" For FBGA packages í Secure package alignment due to self contacting structure without upper pressing force (ZIF) í Contacting structure to nip the sides of solder balls to lower damages of coplanarity of solder balls Outline Base Socket Dimensions A±0.4 B±0.4 Yamaichi's 2-point Tweezer Contact IC Ball Socket Base A Contacts Socket Base B Since the solder balls are touched by two contacts on each side, the solder ball damage can be minimi.

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Datasheet Details

Part number NP352
Manufacturer Yamaichi
File Size 426.63 KB
Description Fine Ball Grid Array
Datasheet download datasheet NP352 Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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NP352 Series (Open Top) Fine Ball Grid Array (FBGA, 1.00mm Pitch) Specifications Insulation Resistance: 1,000MW min. at 100V DC Dielectric Withstanding Voltage: 100V AC for 1 minute Contact Resistance: 100mW max. at 10mA/20mV max. Operating Temperature Range: –40°C to +150°C / -55°C to +150°C Contact Force: 15g per pin approx. Mating Cycles: 10,000 insertions minimun Part Number (Details) NP352 - 560 09 - * - * Series No. No.