KBJ801
Key Features
- UL recognition, file #E230084
- Glass passivated chip junction
- Thin single in-line package
- High surge current capability
- Solder dip 275 °C max. 7 s, per JESD 22-B106
Applications
- Package: 4KBJ Molding pound meets UL 94 V-0 flammability rating, RoHS-pliant
