KBU8005 Overview
Key Specifications
Package: SIL
Mount Type: Through Hole
Pins: 4
Height: 19.304 mm
Key Features
- UL recognition, file #E230084
- Glass passivated chip junction
- Ideal for printed circuit boards
- High surge current capability
- Solder dip 275 °C max. 7 s, per JESD 22-B106