SF13G
Key Features
- Ultrafast reverse recovery time
- Low leakage current
- Low switching losses, high efficiency
- High forward surge capability
- Glass passivated chip junction
- Solder dip 275 °C max. 7 s, per JESD 22-B106
Applications
- Package: DO-204AL(DO-41) Molding pound meets UL 94 V-0 flammability rating, RoHS-pliant
