FAC1801X Overview
FACXXXXX X - Soldering method A or B XX- attenuation: Soldering method A:The gold terminals in this series are just designed to use wire-boning application. Soldering method B:The gold terminals in this series are just designed to use lead free reflow application.
FAC1801X Key Features
- Thin film
- High attenuation accuracy
- Small VSWR
- Ceramic chip: 99% alumina
- Laser trimmed
- Low cost-high performance
- Soldering method A or B