EGP50D Overview
0.220(5.6) 0.190(4.8) DIA. 0.052(1.3) 0.048(1.2) DIA. Dimensions in inches and (millimeters) TM 1.0(25.4) MIN.
EGP50D Key Features
- GPRC (Glass Passivated Rectifier Chip) inside
- Glass passivated cavity-free junction
- Superfast recovery time for high efficiency
- Low forward voltage, high current capability
- Low leakage current
- High surge current capability
- High temperature soldering guaranteed: 260oC/10 seconds
- Plastic package has Underwriters Laboratory Flammability
- 65 to +175
- FORWARD CURRENT DERATING CURVE
