SCD26 Datasheet | Zowie Technology

FEATURES .181(4.60) .173(4.40) .002(0.05) - - - - - - - - - - - - 0.091(2.30) 0.083(2.10) R0. (0.5 0) 0.045(1.15) 0.029(0.75) 0.046(1.16) 0.034(0.86) 0.045(1.15) 0.029(0.75) Lead free product Leadless chip form , no lead damage Lead-free solder joint , no wire bond & lead frame Plastic package has Underwriters Laboratory Flammability Classification 94V-0 For surface mounted applications Low profile package Built-in strain relief Metal to silicon rectifier , majority carrier conduction Low power loss , High efficiency High current capability , low VF High surge capacity For using in low voltage high frequency switching power supply, inverters , free wheeling , and polarity protection applications MECHANICAL DATA Case : Packed with FRP substrate and epoxy underfilled - Dimensions in inches and (millimeters) Terminals : Pure Tin plated (Lead-Free), solderable per MIL-STD-750, Method 2026. Polarity : Laser marking Weight : 0.02 gram MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25 C ambient temperature unless otherwise specified. Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current (SEE FIG.1) SYMBOLS VRRM VRMS VDC I (AV) SCD22 20 14 20 SCD24 40 28 40 o 60 42 60 SCD210 100 70 100 UNITS Volts Volts Volts Amps 2 .0 Peak forward surge current 8.3ms single half sine-wave IFSM superimposed on rated load (JEDEC Method) Maximum instantaneous forward voltage at 2.0 A (NOTE 1) Maximum DC reverse current at rated DC blocking voltage Typical thermal resistance (NOTE 2) R Operating junction temperature range Storage temperature range NOTES : (1) Pulse test width PW=300usec , 1% duty cycle. (2) Mounted on P.C. board with 0.2 x 0.2"(5.0 x5.0mm) copper pad areas. Amps 0.50 0.5 Volts (NOTE 1) @TJ=25 C @TJ=100 C R JA o...