SCD310 Datasheet PDF

FEATURES

.181(4.60) .173(4.40) .002(0.05) 0.091(2.30) 0.083(2.10) R0. 020 (0.5 0) * * * * * * * * * * * * 0.045(1.15) 0.029(0.75) 0.046(1.16) 0.034(0.86) 0.045(1.15) 0.029(0.75) Lead free product Leadless chip form , no lead damage Lead-free solder joint , no wire bond & lead frame Plastic package has Underwriters Laboratory Flammability Classification 94V-0 For surface mounted applications Low profile package Built-in strain relief Metal to silicon rectifier , majority carrier conduction Low power loss , High efficiency High current capability , low VF High surge capacity For using in low voltage high frequency switching power supply, inverters , free wheeling , and polarity protection applications

MECHANICAL DATA

Case : Packed with FRP substrate and epoxy underfilled *Dimensions in inches and (millimeters) TM Terminals : Pure Tin plated (Lead-Free), solderable per MIL-STD-750, Method 2026. Polarity : Laser marking Weight : 0.02 gram

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Ratings at 25 C ambient temperature unless otherwise specified.