Datasheet4U Logo Datasheet4U.com

SMBC210H - Schottky Bridge Rectifier

This page provides the datasheet information for the SMBC210H, a member of the SMBC204H Schottky Bridge Rectifier family.

Features

  • Halogen-free type.
  • Lead free product, compliance to RoHS.
  • Lead less chip form, no lead damage.
  • Lead-free solder joint, no wire bond & lead frame.
  • Low power loss, High efficiency.
  • High current capability.
  • Plastic package has Underwriters Laboratory Flammability Classification 94V-0.

📥 Download Datasheet

Datasheet preview – SMBC210H

Datasheet Details

Part number SMBC210H
Manufacturer Zowie Technology
File Size 40.36 KB
Description Schottky Bridge Rectifier
Datasheet download datasheet SMBC210H Datasheet
Additional preview pages of the SMBC210H datasheet.

📁 Similar Datasheet

  • SMB-141N - SURFACE MOUNT GLASS TUBE (SunMate)
  • SMB-181N - SURFACE MOUNT GLASS TUBE (SunMate)
  • SMB-201M - SURFACE MOUNT GLASS TUBE (SunMate)
  • SMB-251M - SURFACE MOUNT GLASS TUBE (SunMate)
  • SMB-301M - SURFACE MOUNT GLASS TUBE (SunMate)
  • SMB-401M - SURFACE MOUNT GLASS TUBE (SunMate)
  • SMB-471M - SURFACE MOUNT GLASS TUBE (SunMate)
  • SMB-501M - SURFACE MOUNT GLASS TUBE (SunMate)
  • SMB-901M - SURFACE MOUNT GLASS TUBE (SunMate)
  • SMB10 - SURFACE MOUNT UNIDIRECTIONAL AND BIDIRECTIONAL TRANSIENT VOLTAGE SUPPRESSORS (Lite-On Technology)
Other Datasheets by Zowie Technology

Full PDF Text Transcription

Click to expand full text
ZOWIE Schottky Bridge Rectifier (40V~100V / 2A) Preliminary SMBC204H THRU SMBC210H FEATURES * Halogen-free type * Lead free product, compliance to RoHS * Lead less chip form, no lead damage * Lead-free solder joint, no wire bond & lead frame * Low power loss, High efficiency * High current capability * Plastic package has Underwriters Laboratory Flammability Classification 94V-0 OUTLINE DIMENSIONS Case : MBC Unit : mm 4.75 ± 0.1 2.54 ± 0.05 Mounting Pad Layout 1.00 ± 0.05 6.15 ± 0.1 Max. 6.91 ~~ 1.40 ± 0.05 2.54 ± 0.13 APPLICATION * Suitable for battery - powered circuits * Communication Equipment 1.20 ± 0.1 MECHANICAL DATA Case : Packed with FRP substrate and epoxy underfilled Terminals : Pure Tin plated (Lead-Free), solderable per MIL-STD-750, Method 2026.
Published: |