Full PDF Text Transcription for CPD30V (Reference)
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CPD30V. For precise diagrams, and layout, please refer to the original PDF.
PROCESS CPD30V Dual Switching Diode Dual, Common Cathode, High Speed Switching Diode Chip PROCESS DETAILS Die Size Die Thickness Anode 1 Bonding Pad Area Anode 2 Bonding ...
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TAILS Die Size Die Thickness Anode 1 Bonding Pad Area Anode 2 Bonding Pad Area Top Side Metalization Back Side Metalization 15.4 x 15.4 MILS 7.1 MILS 5.9 x 5.9 x 8.3 MILS 5.9 x 5.9 x 8.3 MILS Al - 30,000Å Au-As - 10,000Å GEOMETRY GROSS DIE PER 4 INCH WAFER 46,200 PRINCIPAL DEVICE TYPE CMLD2838 BACKSIDE COMMON CATHODE R0 R2 (6-October 2011) w w w. c e n t r a l s e m i . c o m http://www.Datasheet4U.com PROCESS CPD30V Typical Electrical Characteristics R2 (6-October 2011) w w w. c e n t r a l s e m i . c o m http://www.Datasheet4U.
CPD30V Datasheet
