Full PDF Text Transcription for CPD87R (Reference)
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CPD87R. For precise diagrams, and layout, please refer to the original PDF.
PROCESS CPD87R Schottky Diode Low Leakage Schottky Diode Chip PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metali...
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hickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization EPITAXIAL PLANAR 14.6 x 14.6 MILS 3.9 MILS 11.8 x 11.8 MILS Al - 30,000Å Au - 12,000Å GEOMETRY GROSS DIE PER 5 INCH WAFER 80,698 PRINCIPAL DEVICE TYPES CFSH2-4L R1 (22-March 2010) w w w. c e n t r a l s e m i . c o m http://www.Datasheet4U.com PROCESS CPD87R Typical Electrical Characteristics R1 (22-March 2010) w w w. c e n t r a l s e m i . c o m http://www.Datasheet4U.
CPD87R Datasheet
