Texas Instruments 74AC16823
The 74AC16823 is packaged in TI’s shrink small-outline package (DL), which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area. The 54AC16374 is characterized for operation over the full military temperature range of –55°C to 125°C. The 74AC16823 is characterized for operation from –40°C to 85°C.| Part No. | 74AC16823 |
|---|---|
| Datasheet | 74AC16823 Download |
| Manufacturer |  Texas Instruments |
| Description | 18-BIT BUS INTERFACE FLIP-FLOPS |
| Buy | Stock & Price |
54AC16823, 74AC16823 18-BIT BUS INTERFACE FLIP-FLOPS WITH 3-STATE OUTPUTS SCAS243A – APRIL 1991 – REVISED APRIL 1996 D Members of the Texas Instruments Widebus ™ Family D Provides Extra Data Width Necessary for Wider Address/Data Paths or Buses With Parity D Flow-Through Architecture Optimizes PCB Layout D Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise D EPIC ™ (Enhanced-Performance Implanted CMOS) 1-µm Process D 500-mA Typical Latch-Up Immunity at 125°C D Package Options Include Plastic 300-mil Shrink Small-Outline (DL) Package Using 25-mil Center-to-Center Pin Spacings and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Pin Spacings description These 18-bit flip-flops feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing wider buffer registers, I/O ports, parity bus interfacing, and working registers. The ’AC16823 can be used as two 9-bit flip-flops or one 18-bit flip-flop.
