Texas Instruments 74ACT16374
The 74ACT16374 is packaged in TI’s shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit board area. The SN54ACT16374 is characterized for operation over the full military temperature range of –55°C to 125°C. The 74ACT16374 is characterized for operation from –40°C to 85°C.SN54ACT16374, 74ACT16374 16-BIT D-TYPE EDGE-TRIGGERED FLIP-FLOPS WITH 3-STATE OUTPUTS SCAS124B – MARCH 1990 – REVISED APRIL 1996 D Members of the Texas Instruments Widebust Family D Inputs Are TTL-Voltage Compatible D 3-State Bus-Driving True Outputs D Flow-Through Architecture Optimizes PCB Layout D Distributed Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise D EPICt (Enhanced-Performance Implanted CMOS) 1-mm Process D 500-mA Typical Latch-Up Immunity at 125°C D Package Options Include Plastic 300-mil Shrink Small-Outline (DL) Packages Using 25-mil Center-to-Center Pin Spacings and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Pin Spacings description The SN54ACT16374 and 74ACT16374 are 16-bit edge-triggered D-type flip-flops with 3-state outputs designed specifically for driving highly-capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.