Texas Instruments 74F244
The ′F244 is organized as two 4-bit buffers/line drivers with separate output enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs.| Part No. | 74F244 |
|---|---|
| Datasheet | 74F244 Download |
| Manufacturer |  Texas Instruments |
| Description | Octal Buffers/Line Drivers |
| Buy | Stock & Price |
● 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
● Package Options Include Plastic Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs description These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Taken together with the ′F240 and ′F241, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical OE (active-low output-enable) inputs, and complementary OE and OE inputs. When OE is high, the outputs are in the high-impedance state. The SN74F244 is available in TI’s shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area. The SN54F244 is characterized for operation over the full military temperature range of − 55°C to 125°C.
● Package Options Include Plastic Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs description These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Taken together with the ′F240 and ′F241, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical OE (active-low output-enable) inputs, and complementary OE and OE inputs. When OE is high, the outputs are in the high-impedance state. The SN74F244 is available in TI’s shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area. The SN54F244 is characterized for operation over the full military temperature range of − 55°C to 125°C.
