CSD16406Q3 Overview
This 25 V, 4.2 mΩ, 3.3 mm × 3.3 mm SON NexFET™ power MOSFET has been designed to minimize losses in power conversion applications. Cu pad on a 0.06 inch thick FR4 PCB. CSD16406Q3 SLPS202B AUGUST 2009 REVISED DECEMBER 2015 .ti.
CSD16406Q3 Key Features
- 1 Ultra-Low Qg and Qgd
- Low Thermal Resistance
- Avalanche Rated
- Pb Free Terminal Plating
- RoHS pliant
- Halogen Free
- SON 3.3 mm × 3.3 mm Plastic Package
CSD16406Q3 Applications
- Point-of-Load Synchronous Buck Converter for Applications in Networking, Tele, and puting Systems
- Optimized for Control or Synchronous FET Applications