APPLICATIONS
− Battery-Powered Systems, PDAs, Notebooks, Laptops, Palmtop PCs, and Hand-Held Equipment description/ordering information DB OR DW PACKAGE (TOP VIEW) DOUT3 DOUT1 DOUT2 RIN1 ROUT1 DIN2 DIN1 GND VCC C1+ V+ C1− 1 2 3 4 5 6 7 8 9 10 11 12 24 DOUT4 23 RIN2 22 ROUT2 21 DIN5 20 DOUT5 19 DIN4 18 DIN3 17 ROUT3 16 RIN3 15 V− 14 C2− 13 C2+ The devices operate at data signaling rates up to 120 kbit/s and a maximum of 30-V/µs driver output slew rate. ORDERING INFORMATION TA PACKAGE† ORDERABLE PART NUMBER TOP-SIDE MARKING 0°C to 70°C SOIC (DW) SSOP (DB) Tube of 25 Reel of 2000 Reel of 2000 MAX207CDW MAX207CDWR MAX207CDBR MAX207C MA207C SOIC (DW) −40°C to 85°C Tube of 25 Reel of 2000 MAX207IDW MAX207IDWR MAX207I SSOP (DB) Reel of 2000 MAX207IDBR MB207I † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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