Texas Instruments PAL16R8AM
The PAL16’ M series is characterized for operation over the full military temperature range of –55°C to 125°C.| Part No. | PAL16R8AM |
|---|---|
| Datasheet | PAL16R8AM Download |
| Manufacturer |  Texas Instruments |
| Description | These programmable array logic |
| Buy | Stock & Price |
PAL16L8AM, PAL16L8A-2M, PAL16R4AM, PAL16R4A-2M PAL16R6AM, PAL16R6A-2M, PAL16R8AM, PAL16R8A-2M STANDARD HIGH-SPEED PAL® CIRCUITS SRPS016 – D2705, FEBRUARY 1984 – REVISED MARCH 1992
● Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min
● Choice of Input/Output Configuration
● Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package DEVICE I 3-STATE INPUTS O OUTPUTS PAL16L8 10 2 PAL16R4 8 0 PAL16R6 8 0 PAL16R8 8 0 REGISTERED Q OUTPUTS 0 4 (3-state buffers) 6 (3-state buffers) 8 (3-state buffers) I/O PORT S 6 4 2 0 PAL16L8’ J OR W PACKAGE (TOP VIEW) I1 I2 I3 I4 I5 I6 I7 I8 I9 GND 10 20 VCC 19 O 18 I/O 17 I/O 16 I/O 15 I/O 14 I/O 13 I/O 12 O 11 I description These programmable array logic devices feature high speed and a choice of either standard or half-power devices. They combine Advanced Low-Power Schottky technology with proven titanium-tungsten fuses. These devices will provide reliable, high-performance substitutes for conventional TTL logic.
● Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min
● Choice of Input/Output Configuration
● Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package DEVICE I 3-STATE INPUTS O OUTPUTS PAL16L8 10 2 PAL16R4 8 0 PAL16R6 8 0 PAL16R8 8 0 REGISTERED Q OUTPUTS 0 4 (3-state buffers) 6 (3-state buffers) 8 (3-state buffers) I/O PORT S 6 4 2 0 PAL16L8’ J OR W PACKAGE (TOP VIEW) I1 I2 I3 I4 I5 I6 I7 I8 I9 GND 10 20 VCC 19 O 18 I/O 17 I/O 16 I/O 15 I/O 14 I/O 13 I/O 12 O 11 I description These programmable array logic devices feature high speed and a choice of either standard or half-power devices. They combine Advanced Low-Power Schottky technology with proven titanium-tungsten fuses. These devices will provide reliable, high-performance substitutes for conventional TTL logic.
