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TMP006B Datasheet Infrared Thermopile Sensor

Manufacturer: Texas Instruments

Overview: Product Folder Sample & Buy Technical Documents Tools & Software Support & Community TMP006, TMP006B SBOS518E – MAY 2011 – REVISED APRIL 2015 TMP006/B Infrared Thermopile Sensor in Chip-Scale Package.

This datasheet includes multiple variants, all published together in a single manufacturer document.

General Description

The TMP006 and TMP006B are fully integrated MEMs thermopile sensors that measure the temperature of an object without having to be in direct contact.

The thermopile absorbs passive infrared energy from an object at wavelengths between 4 um to 16 um within the end-user defined field of view.

The corresponding change in voltage across the thermopile is digitized and reported with the on-chip die thermal sensor measurement through an I2C- and SMBus-compatible interface.

Key Features

  • 1 Integrated MEMs Thermopile for Noncontact Temperature Sensing.
  • Local Temperature Sensor for Cold Junction Reference.
  • ±1°C (max) from 0°C to 60°C.
  • ±1.5°C (max) from.
  • 40°C to +125°C.
  • Two-Wire Serial Interface Options:.
  • I2C and SMBus Compatible.
  • TMP006 at 3.3 V.
  • TMP006B at 1.8 V.
  • Eight Programmable Addresses.
  • Low Power.
  • Supply: 2.2 V to 5.5 V.
  • Active Current: 240 μA (typ).

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