UCC37323 Overview
Prop Delay SOIC (8): 4.90 mm × 3.91 mm MSOP-PowerPAD (8): 3.00 mm × 3.00 mm Copyright © 2016, Texas Instruments Incorporated An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical
UCC37323 Key Features
- 1 Bi-CMOS Output Architecture
- ±4 A Drive Current at the Miller Plateau Region
- Constant-Current Even at Low Supply Voltages
- Outputs Paralleled for Higher Drive Current
- Available in MSOP-PowerPAD™ Package
- TTL/CMOS Inputs Independent of Supply Voltage
- Industry-Standard Pin-Out