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MCFT02 - Wire Wound Chip Inductor

Features

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  •   Ceramic base provide high SRF Ultra-compact inductors provide high Q factors Low profile, high current options Miniature SMD chip inductor for fully automated assembly Outstanding endurance from Pull-up force, mechanical  shock and pressure.
  •   Tighter tolerance down to ±2%.
  •   Smaller size of 0402 (1005) Construction.

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Datasheet Details

Part number MCFT02
Manufacturer multicomp
File Size 853.20 KB
Description Wire Wound Chip Inductor
Datasheet download datasheet MCFT02 Datasheet

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Wire Wound Chip Inductor Features •  •  •  •  •  Ceramic base provide high SRF Ultra-compact inductors provide high Q factors Low profile, high current options Miniature SMD chip inductor for fully automated assembly Outstanding endurance from Pull-up force, mechanical  shock and pressure •  Tighter tolerance down to ±2% •  Smaller size of 0402 (1005) Construction Applications RF Products: •  •  •  •  •  •  •  •  •  Cellular Phone (CDMA/GSM/PHS) Cordless Phone (DECT/CT1CT2) Remote Control, Security System Wireless PDA Smart Phone WLL, Wireless LAN / Mouse / Keyboard / Earphone VCO, RF Module & Other Wireless Products Base Station, Repeater GPS Receiver 1 2 Ceramic Core Magnet Wire 3 Electrode (Ag/Pd+Ni+Sn) 4 UV Glue Broad Band Applications: •  CATV Filter, Tuner •  Cable Modem/ XDSL
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