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BC55-16PAS - 60V 1A NPN medium power transistors

Download the BC55-16PAS datasheet PDF. This datasheet also covers the BC55PAS variant, as both devices belong to the same 60v 1a npn medium power transistors family and are provided as variant models within a single manufacturer datasheet.

General Description

NPN medium power transistor series encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads.

2.

Key Features

  • High collector current capability IC and ICM.
  • Reduced Printed-Circuit Board (PCB) area requirements.
  • Exposed heat sink for excellent thermal and electrical conductivity.
  • Two current gain selections.
  • Leadless very small SMD plastic package with medium power capability.
  • Suitable for Automatic Optical Inspection (AOI) of solder joint 3.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (BC55PAS-nexperia.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number BC55-16PAS
Manufacturer Nexperia
File Size 250.39 KB
Description 60V 1A NPN medium power transistors
Datasheet download datasheet BC55-16PAS Datasheet

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Other Datasheets by Nexperia

Part Number Description
BC55-16PAS-Q 60V 1A NPN medium power transistors
BC55-16PA-Q 1A NPN medium power transistors
BC55-10PA-Q 1A NPN medium power transistors
BC55-10PAS 60V 1A NPN medium power transistors
BC55-10PAS-Q 60V 1A NPN medium power transistors

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
BC55xPAS series 60 V, 1 A NPN medium power transistors 9 October 2024 Product data sheet 1. General description NPN medium power transistor series encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads. 2. Features and benefits • High collector current capability IC and ICM • Reduced Printed-Circuit Board (PCB) area requirements • Exposed heat sink for excellent thermal and electrical conductivity • Two current gain selections • Leadless very small SMD plastic package with medium power capability • Suitable for Automatic Optical Inspection (AOI) of solder joint 3.