BC807-16QC-Q
Description
PNP general-purpose transistor in an ultra small DFN1412D-3 (SOT8009) leadless SurfaceMounted Device (SMD) plastic package with side-wettable flanks.
Key Features
- High power dissipation capability
- High current
- Three current gain selections
- Suitable for Automatic Optical Inspection (AOI) of solder joint
- Smaller footprint pared to conventional leaded SMD packages
- Low package height of 0.5 mm
- Qualified according to AEC-Q101 and remended for use in automotive applications
Applications
- Space restricted applications
