BUK7S2R0-40H
BUK7S2R0-40H is standard level MOSFET manufactured by Nexperia.
description
Automotive qualified N-channel MOSFET using the latest Trench 9 low ohmic superjunction technology, housed in a copper-clip LFPAK88 package. This product has been fully designed and qualified to meet beyond AEC-Q101 requirements delivering high performance and reliability.
2. Features and benefits
- Fully automotive qualified to beyond AEC-Q101:
- -55 °C to +175 °C rating suitable for thermally demanding environments
- LFPAK88 package:
- Designed for smaller footprint and improved power density over older wire bond packages such as D²PAK for today’s space constrained high power automotive applications
- Thin package and copper clip enables LFPAK88 to be highly efficient thermally
- LFPAK copper clip technology enabling improvements over wire bond packages by:
- Increased maximum current capability and excellent current spreading
- Improved RDSon
- Low source inductance
- Low thermal resistance Rth
- LFPAK Gull Wing leads:
- Flexible leads enabling high Board Level Reliability absorbing mechanical and thermal cycling stress, unlike traditional QFN packages
- Visual (AOI) soldering inspection, no need for expensive x-ray equipment
- Easy solder wetting for good mechanical solder joint
- Unique 40 V Trench 9 superjunction technology:
- Reduced cell pitch and superjunction platform enables lower RDSon in the same footprint
- Improved SOA and avalanche capability pared to standard Trench MOS
- Tight VGS(th) limits enable easy paralleling of MOSFETs
3. Applications
- 12 V automotive systems
- 48 V DC/DC systems (on 12 V secondary side)
- Higher power motors, lamps and solenoid control
- Reverse polarity protection
- Ultra high performance power switching
4. Quick reference data
Table 1. Quick reference data
Symbol
Parameter
VDS drain-source voltage
ID drain current
Ptot total power dissipation
Conditions 25 °C ≤ Tj ≤ 175 °C VGS = 10 V; Tmb = 25 °C; Fig. 2 Tmb = 25 °C; Fig. 1
Min Typ Max Unit
- -
[1]
-...
