BUK7V4R2-40H
Overview
Dual, standard level N-channel MOSFET in an LFPAK56D package (half-bridge configuration), using Trench 9 TrenchMOS technology. This product has been designed and qualified to AEC-Q101.
- LFPAK56D package with half-bridge configuration enables:
- Reduced PCB layout complexity
- PCB shrinkage through reduced component footprint for 3-phase motor drive
- Improved system level Rth(j-amb) due to optimized package design
- Lower parasitic inductance to support higher efficiency
- Footprint compatibility with LFPAK56D Dual package
- Advanced AEC-Q101 grade Trench 9 silicon technology:
- Low power losses, high power density
- Superior avalanche performance
- Repetitive avalanche rated
