Datasheet4U Logo Datasheet4U.com

PMEG3010EXD-Q - 30V 1A Schottky barrier rectifier

General Description

Planar Schottky barrier rectifier encapsulated in a CFP2-HP (SOD323HP) power flat lead SurfaceMounted Device (SMD) plastic package.

2.

Key Features

  • Low forward voltage.
  • High power capability due to clip-bond package.
  • Power flat lead plastic package with exposed heatsink for optimal thermal connection.
  • Qualified according to AEC-Q101 and recommended for use in automotive.

📥 Download Datasheet

📁 Similar Datasheet

Brand Logo Part Number Description Manufacturer
NXP Logo PMEG3010EB MEGA Schottky barrier rectifier NXP
NXP Semiconductors Logo PMEG3010EH 1A very low VF MEGA Schottky barrier rectifiers NXP Semiconductors
NXP Semiconductors Logo PMEG3010EJ 1A very low VF MEGA Schottky barrier rectifiers NXP Semiconductors
NXP Logo PMEG3010EP 1A Low VF MEGA Schottky Barrier Rectifier NXP
NXP Logo PMEG3010ER 1A Low VF MEGA Schottky Barrier Rectifier NXP

More Datasheets from Nexperia

Part Number Description
PMEG3010EGW MEGA Schottky barrier rectifier
PMEG3010EGW-Q 1A low VF Schottky barrier rectifier
PMEG3010EH MEGA Schottky barrier rectifiers
PMEG3010EJ MEGA Schottky barrier rectifiers
PMEG3010EP MEGA Schottky barrier rectifier
PMEG3010ER 1A low VF MEGA Schottky barrier rectifier
PMEG3010ESB MEGA Schottky barrier rectifier
PMEG3010ET MEGA Schottky barrier rectifiers
PMEG3010AESA MEGA Schottky barrier rectifier
PMEG3010AESB MEGA Schottky barrier rectifier

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
PMEG3010EXD-Q 30 V, 1 A Schottky barrier rectifier 23 January 2025 Product data sheet 1. General description Planar Schottky barrier rectifier encapsulated in a CFP2-HP (SOD323HP) power flat lead SurfaceMounted Device (SMD) plastic package. 2. Features and benefits • Low forward voltage • High power capability due to clip-bond package • Power flat lead plastic package with exposed heatsink for optimal thermal connection • Qualified according to AEC-Q101 and recommended for use in automotive applications 3. Applications • Low voltage rectification • High efficiency DC-to-DC conversion • Freewheeling • Reverse polarity protection • OR-ing 4. Quick reference data Table 1.