Datasheet4U Logo Datasheet4U.com

PMEG4010ETP - MEGA Schottky barrier rectifier

Description

Planar Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package.

2.

Features

  • Average forward current: IF(AV) ≤ 1 A.
  • Reverse voltage: VR ≤ 40 V.
  • Low forward voltage.
  • High power capability due to clip-bonding technology.
  • Small and flat lead SMD plastic package.
  • High temperature Tj ≤ 175 °C.
  • Suitable for both reflow and wave soldering 3.

📥 Download Datasheet

Datasheet preview – PMEG4010ETP

Datasheet Details

Part number PMEG4010ETP
Manufacturer nexperia
File Size 248.67 KB
Description MEGA Schottky barrier rectifier
Datasheet download datasheet PMEG4010ETP Datasheet
Additional preview pages of the PMEG4010ETP datasheet.

📁 Similar Datasheet

  • PMEG4010ETR - High-temperature 40V 1A Schottky barrier rectifier (NXP Semiconductors)
  • PMEG4010EH - 1A very low VF MEGA Schottky barrier rectifiers (NXP Semiconductors)
  • PMEG4010EJ - 1A very low VF MEGA Schottky barrier rectifiers (NXP Semiconductors)
  • PMEG4010EP - 1 A low VF MEGA Schottky barrier rectifier (NXP Semiconductors)
  • PMEG4010EPK - 40V 1A low VF MEGA Schottky barrier rectifier (NXP Semiconductors)
  • PMEG4010ER - 1 A low VF MEGA Schottky barrier rectifier (NXP Semiconductors)
  • PMEG4010ESB - low VF MEGA Schottky barrier rectifier (NXP)
  • PMEG4010AESB - low VF MEGA Schottky barrier rectifier (NXP)
  • PMEG4010BEA - 1A very low VF MEGA Schottky barrier rectifier (NXP Semiconductors)
  • PMEG4010BEV - 1A very low VF MEGA Schottky barrier rectifier (NXP Semiconductors)
Other Datasheets by nexperia

Full PDF Text Transcription

Click to expand full text
PMEG4010ETP High temperature 40 V, 1 A low VF Schottky barrier rectifier 20 February 2023 Product data sheet 1. General description Planar Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Average forward current: IF(AV) ≤ 1 A • Reverse voltage: VR ≤ 40 V • Low forward voltage • High power capability due to clip-bonding technology • Small and flat lead SMD plastic package • High temperature Tj ≤ 175 °C • Suitable for both reflow and wave soldering 3.
Published: |