Datasheet4U Logo Datasheet4U.com

PMEG40T30EP - 3A low VF Trench MEGA Schottky barrier rectifier

Datasheet Summary

Description

Trench Maximum Efficiency General Application (MEGA) Schottky barrier rectifier encapsulated in a CFP5 (SOD128) small and flat lead Surface-Mounted Device (SMD) plastic package.

2.

Features

  • Average forward current: IF(AV) ≤ 3 A.
  • Reverse voltage: VR ≤ 40 V.
  • Low forward voltage.
  • Low leakage current due to Trench MEGA Schottky technology.
  • High power capability due to clip-bonding technology.
  • Small and flat lead SMD plastic package.
  • Suitable for both reflow and wave soldering 3.

📥 Download Datasheet

Datasheet preview – PMEG40T30EP

Datasheet Details

Part number PMEG40T30EP
Manufacturer nexperia
File Size 837.30 KB
Description 3A low VF Trench MEGA Schottky barrier rectifier
Datasheet download datasheet PMEG40T30EP Datasheet
Additional preview pages of the PMEG40T30EP datasheet.

📁 Similar Datasheet

  • PMEG4002AESF - 0.2A low VF MEGA Schottky barrier rectifier (NXP)
  • PMEG4002EB - 0.2 A very low Vf MEGA Schottky barrier rectifier (NXP)
  • PMEG4002EJ - 200 MA Low Vf MEGA Schottky Barrier Rectifier (NXP)
  • PMEG4002EL - MEGA SCHOTTKY BARRIER RECTIFIER (NXP Semiconductors)
  • PMEG4002ELD - 0.2A low VF MEGA Schottky barrier rectifier (NXP Semiconductors)
  • PMEG4002ESF - low VF MEGA Schottky barrier rectifier (NXP)
  • PMEG4005AEA - Very low VF MEGA Schottky barrier rectifiers (Philips)
  • PMEG4005AESF - MEGA Schottky barrier rectifier (NXP)
  • PMEG4005AEV - (PMEGx005AEV) Very low VF MEGA Schottky barrier rectifiers (NXP Semiconductors)
  • PMEG4005CT - dual MEGA Schottky barrier rectifier (NXP)
Other Datasheets by nexperia

Full PDF Text Transcription

Click to expand full text
PMEG40T30EP 40 V, 3 A low VF Trench MEGA Schottky barrier rectifier 1 April 2023 Product data sheet 1. General description Trench Maximum Efficiency General Application (MEGA) Schottky barrier rectifier encapsulated in a CFP5 (SOD128) small and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Average forward current: IF(AV) ≤ 3 A • Reverse voltage: VR ≤ 40 V • Low forward voltage • Low leakage current due to Trench MEGA Schottky technology • High power capability due to clip-bonding technology • Small and flat lead SMD plastic package • Suitable for both reflow and wave soldering 3.
Published: |