PSMN012-60HL Key Features
- High reliability LFPAK56D package, copper-clip, solder die attach and qualified to 175 °C
- Tested to 1 Bn avalanche events
- LFPAK copper clip package technology
- Copper-clip, solder die attach
- High robustness and reliability
| Manufacturer | Part Number | Description |
|---|---|---|
| PSMN012-60YS | N-Channel MOSFET |