PSMN012-60HL
Overview
Dual logic level N-channel MOSFET in an LFPAK56D (Dual Power-SO8) package, using application specific (ASFET) repetitive avalanche silicon technology.
- High reliability LFPAK56D package, copper-clip, solder die attach and qualified to 175 °C
- Tested to 1 Bn avalanche events
- LFPAK copper clip package technology
- Copper-clip, solder die attach
- High robustness and reliability
