Description
Dual, logic level N-channel MOSFET in an LFPAK56D package (halfbridge configuration), using NextpowerS3 technology.
Features
- LFPAK56D package with half-bridge configuration enables:.
- Reduced PCB layout complexity.
- Module shrinkage through reduced component count.
- Improved system level Rth(j-amb) due to optimized package design.
- Lower parasitic inductance to support higher efficiency.
- Footprint compatibility with LFPAK56D Dual package.
- NextpowerS3 technology.
- Low power losses, high power density.
- Superior avalanche performance.
- R.
PSMN013-40VLD Datasheet
